Packing plate cracking problem is often done in the packaging board in the drying process, at the time of purchase of raw materials packaging board should pay attention to whether cracking log, if found at fault surface cracking, then skinning a log not only crack on the surface of the fault, also can produce crack on the surface, but in stripping process than net peeling on the cracking phenomena will reduce a lot of. Generally speaking, the faster the drying in the process of processing the packaging board, the more serious the cracking phenomenon is. When the plate is processed, the moisture content of the plate is lower than the fiber saturation point, the packaging board will begin to shrink and crack.